FROM MATERIAL
TO INTELLIGENT SYSTEM
Research-focused student organization at Wrocław University of Science and Technology.
SCIENTIFIC SUPERVISOR: DR INŻ. KRZYSZTOF STOJEK
Advanced Assembly
Soldering • Bonding • Sintering
Materials Characterization
Thermal • Structural • Reliability
Process Development
Optimization & Validation
System Integration
Functional Digital Layers
Core Research Pillars
ENGINEERING THE DEEP TECH SPECTRUM
Competence-oriented research in advanced electronics, materials engineering, and intelligent systems integration.
Advanced Electronic Assembly
Specializing in micro-scale precision welding, soldering technologies, and metal powder sintering. We develop the physical substrates for next-generation systems.
- precision_manufacturing SOLDERING TECHNOLOGIES
- heat_pump WELDING & BONDING
- grain METAL POWDER SINTERING
Materials Engineering
Engineering the properties of modern electronics through thermal properties analysis, microstructure inspection, and reliability testing.
- thermostat THERMAL PROPERTIES
- search MICROSTRUCTURE ANALYSIS
- verified_user RELIABILITY & DURABILITY
Integration of Intelligent Systems
Creating functional integration layers to bridge advanced electronic assemblies with autonomous digital logic.
- settings_input_hdmi DIGITAL SYSTEMS AS FUNCTIONAL LAYERS
JOIN KN EPIC
Ready to dive into advanced electronics and materials engineering? We are looking for passionate students to expand our laboratory research team at WUST.
person_search Who We Are Looking For
- Electronics & Telecommunications students
- Materials Engineering & Mechatronics enthusiasts
- Automation, Robotics & Software developers
- Hands-on passion for deep tech and lab work
military_tech What We Offer
Application Status: Awaiting Input...
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